Description
When you need glue fast – Think Tecbond 15mm glue sticks. Tecbond 135 -15mm glue sticks offer an increased output of 30% more molten glue per trigger pull, and with the glue gun holding up to 60% more glue means you do not need to reload as often as you would with a standard 12mm glue stick!
TECBOND 135 15mm glue sticks are an economical long open time hot melt with a medium viscosity. It can be used on a wide array of substrates covering off industries such as woodworking (excellent for bonding Corian), flooring, tile display boards and can be used for bonding porous surfaces, such as foams and fabrics. Good adhesion to rigid PVC constituent
All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).
For use with all Tec 15mm glue guns.
- Best joint designs for hot melt gluing
- What is a cold bond ?
- Are glue sticks waterproof ?
- What is a Hot Melt Adhesive?
- What makes a Tecbond hot melt glue sticks… stick?
- Hot Melt fumes
Important: Hot Melt Adhesives do have limitations! Being a thermoplastic product hot melt adhesives soften with heat and return to a solid state by the loss of heat. With this in mind, standard hot melt adhesives are not recommend for applications subjected to heat or direct sunlight. However we do offer grades with high heat resistance. Water and hot melt adhesives are a bad combination – standard hot melt adhesives are not waterproof and should be avoided for external applications. On saying this, we do have PUR adhesives that can be use externally and can even be dry cleaned. We strongly recommend that you thoroughly test the product and satisfy yourselves that the product is suitable for your application. This product suggested uses are a generalised suggestion and other factors may play a role in achieving the required bond, e.g. heat resistance, chemical resistance, gap filling, surface area to glue, open time or a degree of glue flexibility may be required etc.
Please contact our technical team on 0161 627 1001 to discuss your application in further detail
