Tecbond Polyamide (PA) Hot Melt Adhesives
Tecbond Polyamide based hot melt adhesives are a higher performance polymer that is used where better resistance to temperature extremes and good chemical resistance is required. […]
Tecbond Polyamide based hot melt adhesives are a higher performance polymer that is used where better resistance to temperature extremes and good chemical resistance is required. […]
Problem solving adhesive for product assembly Tecbond 7785 is a tough flexible polyamide based hot melt adhesive that exhibits a very high molten tack and excellent adhesion to many difficult to bond substrates. A true problem-solving adhesive for the electronics and product assembly industries. Tecbond 7785 one of several polyamide adhesives from the Tecbond stable […]