Companies are changing to Tecbond 7718 polyamide glue sticks for Potting and Encapsulating electric components, seal switches and wires in the electronics, automotive and aerospace industries because of the benefits offered by a hot melt adhesive. Traditionally the process involved the use of epoxy resins or silicone based products to prevent corrosion and moisture ingress. […]
Tecbond Polyamide based hot melt adhesives are a higher performance polymer that is used where better resistance to temperature extremes and good chemical resistance is required. […]
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