Description

Technomelt 4664 ME Micro Emission adhesive for flat lamination and general assembly work

Application Areas

● Lamination

● General assembly work

● Assembly bonding of wooden parts

● Gluing of textiles and plastics Product

Properties

● Reactive hotmelt adhesive system based on polyurethane

● MicroEmission (ME) contains less than 0,1% isocyanate monomer

● MicroEmission (ME) reduces isocyanate vapors by up to 90%

● High initial strength

● Chemical cross-linking within few days

● Bond joint turns into a thermoset

● Very high heat resistance (> 150 °C/> 302 °F) and cold flexibility

● Excellent water resistance

● Resistant to most solvents

Mindful of health and safety, companies are now asking, what options are available with the PUR adhesives that would allow them to improve their operating procedures whilst at the same time reducing risk. The solution is simple – Technomelt Micro Emissions (ME) PUR adhesives.  These adhesives offer the same performance benefits that come with PUR technologies, low coat weight, tight joints, invisible glue lines, exceptional high performance combined with excellent heat and water resistance but without the hazardous labelling, making it more environmentally friendly and safer for operators to handle.