Description

Tecbond 351-PR has been developed for case sealing and is ideal for a wide range of applications where a fast speed of set is required.

It has a versatile level of adhesion and retains bond integrity at high and low ambient temperatures. It is a very high-quality low odour product that is exceptionally heat stable; It is very clean running and will reduce filter and nozzle blockages in the application equipment.

Methods of application: Bulk hot melt tank, best applied by jet.

Suggested application temperature:  160-180ºC / 320-356ºF depending on substrates to be bonded.

F.D.A approved. All the constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (Adhesives).

Health & safety please refer to Power Adhesives Safety Data Sheet.