Description

Tecbond 138 hot melt adhesive is formulated using a minimum of 40% Bio Based raw materials!

Tecbond 138 very fast setting adhesive designed for packaging application, carton sealing, tray erecting and point of sale.

A combination of fast set time and medium viscosity allows Tecbond 138 to be used on a wide range of paper, card, plain and printed board materials. Can be used as a low melt adhesive for heat sensitive materials, e.g. polystyrene and foam applied via a suitable Tec glue gun at a temperature range between 130c-160c

All constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (adhesives).

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