Description

Tecbond 355-PR is a fast-setting adhesive, with high adhesion to lacquered /varnished boards while retaining low temperature performance.

Tecbond 355-PR exhibits low thermal degradation/charring combined with very clean running characteristics Tecbond 355-PR is ideally suited to packing and case sealing applications where low temperatures storage is expected. Tests have shown that fibre tear can be achieved at temperatures as low as-30°C on lacquered boards.

Methods of application: Bulk hot melt tank, best applied by jet.

Suggested application temperature:  160-180ºC / 320-356ºF depending on substrates to be bonded.

F.D.A approved. All the constituent parts of this adhesive have been approved by the American F.D.A under C.F.R 21.175.105 (Adhesives).

Health & safety please refer to Power Adhesives Safety Data Sheet.