Description
Tecbond 110-PR is a high speed packaging adhesive designed for case sealing. It is an economical general purpose packaging grade that can be used for most packaging applications
Methods of application
Bulk hotmelt tank, can be jetted and spray applied. Tec 4500 pneumatic glue gun
Suggested application temperature
Suggested application temperature is 160c-180c depending on substrates to be bonded.
FDA approved. All constituent parts of the adhesive have been approved by the American FDA under C.F.R 21.175.105
